Quote:
Originally Posted by John Jordan
Stephen-
interesting point about putting the pads under the component and not the feet. Now you got the gears turning in the old noggin. The ridged rubber pad on top and bottom makes them very solidly stackable. One can also use a 3 x 3 on the bottom with a 2 x 2 on top for full support.
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Yeah, personally, I'm not a fan of placing vibration isolation devices under the components own feet; the mechanical coupling (aka "grounding) can't be ideal; therefore the pad's ability to keep energy from transferring into the component would be less that optimal or maximal, I would think.
Just as a side-note; I went to my SFAS meeting on Saturday (SF Audiophile Society) and we had Andrew Jones as our guest speaker. He was demonstrating the new ELAC Navis active speakers (which were REALLY impressive) and he was using the new ELAC Alchemy preamp/DAC/streamer. He was using four pair of the Diversitech AVPs with each pair stacked on top of each other, with the ribs oriented at 90° to each stacked pair. And they were placed directly under the component, not under its attached feet. And, as one of the best loudspeaker designers in the world, I would think Andrew would know a thing or so about managing vibration.
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Lumin P1 streamer/DAC/preamp, Constellation Inspiration integrated TT: Michell Gyro SE MkII, SME V, Koetsu Urushi Vermilion, EAR324. Harbeth 30.2s, REL R-305, Shunyata Alpha V2 ICs, Alpha V2 SPs, Sigma XC, Sigma NRv2, Omega QR-s & Alpha NRv2 PCs, segmented Altaira SG stack w/ Alpha & Omega CGCs, Everest 8000 PD. Remote Server Room: Uptone EtherREGEN, AfterDark Master Clock & LPS, Alita, Battle Angel, (Akasa NUC Roon Core), iFi DC Purifiers (for SMPS used for Alita & router), Shunyata Gemini combo power distributor & Altaira-type CG GP-NR hub, Venom & Alpha CGCs, Shunyata NRv14 power cords for digital components.
Last edited by Puma Cat; 01-23-2020 at 02:07 PM.
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